AMMM 2020 Overview 中文页面
International Conference on Advances in Materials, Mechanical and Manufacturing is a premier, annual forum for researchers and scholars from multiple disciplines to come together to share knowledge, discuss ideas, exchange information, and learn about cutting-edge research in diverse fields with the common theme of Materials, Mechanical and Manufacturing. 2020 the 2nd International Conference on Advances in Materials, Mechanical and Manufacturing (AMMM 2020) will be held in Singapore on March 27-29, 2020, co-located with ICSRT 2020 conference.
2020年第二届材料，机械与制造发展国际会议(AMMM 2020) 将于3月27-29日在新加坡召开。AMMM 2020会议旨在促进材料，机械与制造发展领域相关专家的交流，为相关研究方向的专家学者及企业发展人提供一个分享研究成果、讨论存在的问题与挑战、探索前沿科技的国际性合作交流平台。现热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。
AMMM 2020 fully understand some participants cannot attend the conference due to the coronavirus disease. So except the regular presentation format (oral and poster), AMMM 2020 decided to provide online or video presentation format for those participants. At the same time, 1 online session will be arranged in the afternoon of March 28. Welcome you to attend.(Read more)
Moreover, in order to provide a safer conference environment, the organizer will actively take some actions, such as, encourage every participant wear the mask during the conference, take every participant's temperature before they enter, etc.
All accepted and presented papers will be published in IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981) which be submitted for EI Compendex, Scopus, Thomson Reuters (WoS), Inspec index, et al.
Welcome Prof. Aleksander Muc, Cracow University of Technology, Poland and Assoc. Prof. Rakchart Traiphol, Mahidol University, Thailand to join in our technical committees.
Notification! Considering some authors' requests, the submision deadline has been extended to Feb. 5, 2020 (Final Call). Welcome you to submit the paper or abstract!
Welcome Prof. Mohd Hamdi Bin Abd Shukor, University of Malaya, Malaysia and Prof. Xiaoqing Jin, Chongqing University, China to join us as the technical committee member.
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